Profile

　　Beijing Kexin Mechatronic Research Institute Co., Ltd.is a wholly-owned subsidiaries of Beijing Information Science and Technology University, which was registered in the name of Beijing Kexin Mechanical and Electrical Technology Research Institute in 1990. It is the governing unit of Piezoelectric Crystal Branch of China Electronic Components Industry Association.
　　Relying on the talents and scientific research advantages of Beijing Information Science and Technology University, Beijing Kexin has been focusing on the precision welding technology of metal packaging components for more than 30 years. With the continuous efforts of several generations of R&D personnel, the company has developed a series of precision electronic component packaging equipment with independent intellectual property rights, which effectively alleviates the monopoly and blockade of foreign imported equipment on China's metal component packaging field.
　　For many years, Beijing Kexin has provided a large number of high-quality and durable precision packaging equipment for metal components for semiconductor, microelectronics, optical communication, sensors and other industries in China and made important contributions to the localization of metal packaging equipment for electronic components, and strongly supporting the development of China's electronic industry. Our machines are widely used in aerospace, scientific research institutes and manufacturing enterprises.
　　Our company has become the Identification of high-tech enterprise and has passed the ISO international quality system certification.

Core Technology

　　Precision energy storage resistance welding packaging technology

　　The energy storage capacity ranges from 800 joules to 9000 joules. The round package size can be welded to TO-18, TO-25, TO-38, TO-46, TO-56, TO-9, TO-10, etc. The square package size can be up to 36 × 27mm. The equipment meets the packaging requirements of electronic components for low oxygen, low water vapor, high environment, high vacuum, etc.

　　Metal Surface mounting lement (SMD) packaging technology

　　Kexin has mastered the core technologies of precision positioning such as visual recognition, high-precision image measurement and servo control. Applicable to all welders with diameters from 2.0 × 1.6mm to 13.3 × 6.5mm。

　　High-performance welding power supply technology

　　Kexin has mastered the energy control technology of precision resistance welding, realized the high qualification rate of packaging devices, and ensured the requirements of parallel welding for rapid dynamic response, high stability, high reliability, etc. It can meet the packaging requirements of both 2.0×1.6mm metal surface mount components (SMD) and 300×200mm and other large module components.